3D Inspection
Our coplanarity inspection machines handle leaded components such as QFP, SO, and TSOP packages, as well as ball-type components such as BGA.
We are able to provide detailed measurement reports following each component inspection.
3D Inspection
3D inspection of electronic components is now an essential technology in modern manufacturing processes, particularly in the electronics industry where precision and reliability are critical. It enables highly accurate analysis of dimensions, alignment, pitch, and the deviation of leads or balls on electronic components, providing a far more comprehensive view than traditional 2D inspection systems.
Using advanced sensors, high-resolution cameras, and techniques such as fringe projection or laser triangulation, 3D inspection can detect defects that are invisible to the naked eye or difficult to identify with standard 2D inspection.
This service can be included as part of a programming or packaging process, or used independently as incoming inspection to verify supplier delivery compliance.
This type of inspection is carried out using automated systems and enables control prior to tray loading or tape-and-reel packaging.
This allows you to eliminate placement defects and ensure the proper use of your most valuable components.
Qualification
For each new product, we carry out a validation phase and provide a PPAP Level 2 or 3, depending on your requirements.
Quality control
Quality control
Capacity & competitiveness
Reliability & control
Contact UsWe remain available to assist you and answer your questions.
Feel free to contact us-our team is at your disposal for any request.
