Close

ELSIL Tunisa & SMD Micropackaging

90 rue Khawarizmi ZI Saint Gobain 2014 Megrine riadh - Tunisia


(+216) 71 295 872

3D Inspection

Our coplanarity inspection machines handle leaded components such as QFP, SO, and TSOP packages, as well as ball-type components such as BGA.
We are able to provide detailed measurement reports following each component inspection.

3D Inspection

3D inspection of electronic components is now an essential technology in modern manufacturing processes, particularly in the electronics industry where precision and reliability are critical. It enables highly accurate analysis of dimensions, alignment, pitch, and the deviation of leads or balls on electronic components, providing a far more comprehensive view than traditional 2D inspection systems.

Using advanced sensors, high-resolution cameras, and techniques such as fringe projection or laser triangulation, 3D inspection can detect defects that are invisible to the naked eye or difficult to identify with standard 2D inspection.

This service can be included as part of a programming or packaging process, or used independently as incoming inspection to verify supplier delivery compliance.

This type of inspection is carried out using automated systems and enables control prior to tray loading or tape-and-reel packaging.

This allows you to eliminate placement defects and ensure the proper use of your most valuable components.

Qualification

For each new product, we carry out a validation phase and provide a PPAP Level 2 or 3, depending on your requirements.

ISO
Certification
Employee involvement
Continuous improvement
Process approach
Brochure
Download documentation
Discover our services
Get key information
Programming
Tape & Reel
Marking
Dry pack & services
Customization
Carrier Tape Manufacturing
Consumables

Contact UsWe remain available to assist you and answer your questions.

Feel free to contact us-our team is at your disposal for any request.

Contact details

Contact Us